The company is committed to becoming a leading domestic and world-class provider of automotive semiconductor solutions, always adhering to the core values of "customer first, people-oriented, open innovation, mutual trust and win-win". By deeply focusing on customer needs, continuously promoting technological iteration and industrial ecology construction, the company provides customers with highly competitive products and comprehensive and professional service support, and helps promote the high
Learn moreBased on the LS basic platform, the E, N, and Z series are developed in the same process for various applications such as automotive body control, intelligent cockpit and networking, domain control and area control, chassis and safety, power and ener
The LS product family, consisting of LDO, DC-DC, PMIC, and SBC products, provides MCU with efficient, reliable, and intelligent power supply solutions
Mainly focusing on vehicle MCU and supporting power chips and end-to-end solutions, radiating to the peripheral field
Establish an industrial layout for differentiated product research and development around the "new multi line parallel" pattern of the entire vehicle industry chain
Customer centered, adhering to technological innovation as the foundation, continuously creating "high, precise, and specialized" products
To become a leading domestic and world-class automotive semiconductor enterprise
Green and safe travel, smart chips create the future
Customer first, people-oriented, open innovation, mutual trust and win-win situation
Recently, Li Hongjun, General Manager of Chongqing Liangjiang Collaborative Innovation Zone Construction Investment Development Co., Ltd. (hereinafter referred to as "Liangjiang Collaborative Innovation Zone Company"), and his delegation conducted a research on Chongqing Lanshan Automotive Electronics Co., Ltd. (hereinafter referred to as "Lanshan Electronics") and held an exchange and discussion.
On August 13, 2024, Chongqing Lanshan Automotive Electronics Co., Ltd. (hereinafter referred to as "Lanshan Electronics") held a strategic cooperation signing ceremony with Chongqing University of Posts and Telecommunications (hereinafter referred to as "Chongqing Post") and Chongqing Integrated Circuit Collaborative Innovation Center (hereinafter referred to as "Collaborative Innovation Center") at its headquarters in Chongqing. This signing marks a new stage in the tripartite cooperation.
headquarters address：Building 10, Jintai Intelligent Industrial Park, Liangjiang New Area, Chongqing, 4-5F
Chengdu Branch：No. 1101, Building 2, Taihe International Financial Center, No. 619 Tianfu Third Street, Wuhou District, Chengdu City, Sichuan Province
Suzhou Office：Room 605, 6th Floor, Building B2, Dongfang Chuangzhi Park, No. 18 Jinfang Road, Xietang Street, Suzhou Industrial Park, Suzhou
